The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7254883 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 14, 2007

Filed:

May. 06, 2005
Applicants:

Günter Schmid, Hemhofen, DE;

Hagen Klauk, Erlangen, DE;

Marcus Halik, Erlangen, DE;

Inventors:

Günter Schmid, Hemhofen, DE;

Hagen Klauk, Erlangen, DE;

Marcus Halik, Erlangen, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H02P 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A laminate is formed from a carrier layer and an electrically conductive layer. In one section, the conductive layer is formed into an antenna structure. The laminate is formed by placing a mask onto a packaging film and vapor-depositing aluminum onto the packaging film and the mask. After removal of the mask, only a desired antenna structure remains on a section of the packaging film. Then a microchip, is adhesively bonded to the packaging film and conductively connected to an end of the antenna structure, so that data can be written in or read out without contact in a wireless transponder system.


Find Patent Forward Citations

Schmid, Günter. (2007). Method for manufacturing a packaging material in the form of a laminate with an electrically conductive layer formed as an antenna structure (U.S. Patent No. 7254883). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7254883

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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