The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2007
Filed:
Oct. 29, 2004
Shigeo Kouzuki, Kanagawa, JP;
Satoshi Aida, Kanagawa, JP;
Satoshi Yanagisawa, Kanagawa, JP;
Masaru Izumisawa, Kanagawa, JP;
Hironori Yoshioka, Kanagawa, JP;
Shigeo Kouzuki, Kanagawa, JP;
Satoshi Aida, Kanagawa, JP;
Satoshi Yanagisawa, Kanagawa, JP;
Masaru Izumisawa, Kanagawa, JP;
Hironori Yoshioka, Kanagawa, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A semiconductor device comprises a semiconductor element and a conductive member. The semiconductor element has a semiconductor substrate having first and second major surfaces; a semiconductor layer formed on the first major surface of the semiconductor substrate; a plurality of trenches formed on the semiconductor layer, the trenches being parallel to each other and extending to a first direction; filling material filling the trenches; a first electrode pad provided on the semiconductor layer and connected electrically to a first major electrode; a second major electrode provided on the second major surface; and a gate electrode pad provided on the semiconductor layer and connected to a gate electrode which controls conduction between the first major electrode and the second major electrode. The conductive member is connected to at least one of the first electrode pad and the gate electrode pad via a first contact area. A leading-out direction of the conductive member is substantially parallel to the first direction.