The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2007
Filed:
Feb. 13, 2003
Applicants:
Hong Jun Yu, Seoul, KR;
Jung Ho Kim, Gyeonggi-do, KR;
Inventors:
Hong Jun Yu, Seoul, KR;
Jung Ho Kim, Gyeonggi-do, KR;
Assignee:
JT Corp., Incheon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 23/34 (2006.01); H01L 23/02 (2006.01); H01L 21/48 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention provides a method for manufacturing IC card by laminating a plurality of foils. The method of the present invention includes steps of putting a COB, a contact electrode of the COB facing downward; laying at least 2 foils having a hole, wherein said COB is inserted in said respective holes of the foils; laying a foil not having a hole on the foils having a hole; and compressing all of the foils.