The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2007

Filed:

Dec. 22, 2004
Applicants:

Toshihiro Kusagaya, Kawasaki, JP;

Yasuhiro Yoneda, Kawasaki, JP;

Daisuke Mizutani, Kawasaki, JP;

Kazuhiko Iijima, Kawasaki, JP;

Yuji Suwa, Kasawaki, JP;

Inventors:

Toshihiro Kusagaya, Kawasaki, JP;

Yasuhiro Yoneda, Kawasaki, JP;

Daisuke Mizutani, Kawasaki, JP;

Kazuhiko Iijima, Kawasaki, JP;

Yuji Suwa, Kasawaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

An inexpensive multilayer wiring circuit board capable of conducting high frequency switching operation on the circuit while the generation of high frequency noise is being suppressed by reducing the inductance of the circuit in provided. A multilayer wiring circuit board comprising: an uppermost layer designated as a first layer on which parts are mounted; a second layer on which one of a ground layer and an electric power source layer is arranged; a third layer on which the other is arranged; and an insulating layer arranged between the ground layer and the electric power source layer. A resin layer having a thermoplastic adhesion property on both faces is used as material of the insulating layer arranged between the electric power source layer and the ground layer.


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