The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2007
Filed:
Oct. 06, 2004
Shih-chang Shei, Tainan County, TW;
Yen-wei Chen, Tainan County, TW;
Wei-shou Chen, Tainan County, TW;
Chia-sheng Chang, Tainan County, TW;
Hsin-ming Lo, Tainan County, TW;
Chien-fu Shen, Tainan County, TW;
Shih-Chang Shei, Tainan County, TW;
Yen-Wei Chen, Tainan County, TW;
Wei-Shou Chen, Tainan County, TW;
Chia-Sheng Chang, Tainan County, TW;
Hsin-Ming Lo, Tainan County, TW;
Chien-Fu Shen, Tainan County, TW;
South Epitaxy Corporation, Taiwan, CN;
Abstract
A method for manufacturing a light-emitting diode (LED) is described. The method comprises: providing a temporary substrate; forming an illuminant epitaxial structure on the temporary substrate; forming a first transparent conductive layer on the illuminant epitaxial structure; forming a metal substrate on the first transparent conductive layer; forming an adhesion layer on the metal substrate; providing a supporting substrate, wherein the supporting substrate is connected to the metal substrate by the adhesion layer; removing the temporary substrate, so as to expose a surface of the illuminant epitaxial structure; forming a second transparent conductive layer on the exposed surface of the illuminant epitaxial structure; and forming an electrode on a portion of the second transparent conductive layer.