The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7252874 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 07, 2007

Filed:

Sep. 04, 2001
Applicant:

Tomiya Mori, Miyagi-ken, JP;

Inventor:

Tomiya Mori, Miyagi-ken, JP;

Assignee:

Tohoku Ricoh Company, Ltd., Miyagi-Ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/26 (2006.01); B32B 7/02 (2006.01); B32B 3/00 (2006.01); B32B 27/12 (2006.01); B41N 1/24 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat-sensitive stencil including a thermoplastic resin film on which a porous resin layer and a porous reinforcing layer are formed in succession. A porous fibrous layer may be disposed between the porous resin layer and the porous reinforcing layer.


Find Patent Forward Citations

Mori, Tomiya. (2007). Heat-sensitive stencil, method of preparing stencil printing master and stencil printer (U.S. Patent No. 7252874). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7252874

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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