The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2007
Filed:
May. 05, 2004
Hayato Iwamoto, Kanagawa, JP;
Kei Kinoshita, Villach, AT;
Hajime Ugajin, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
An etching method and etching device are provided, enabling uniform rendering of the thickness of a film for processing on a wafer regardless of the film thickness profile thereof, and thereby enabling global planarizing of the wafer surface. In an etching method, the film thickness profile of the film for processing formed on the wafer is ascertained in advance, and wet etching is performed by discharging an etchant liquid Lat a thick portion of the film for processing; simultaneously with the discharge of the etchant liquid L, a diluting liquid Lfor the etchant liquid Lis discharged at a thin portion of the film for processing.