The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 31, 2007

Filed:

Mar. 29, 2005
Applicants:

Tsutomu Takeya, Niigata-ken, JP;

Kazuhiko Nakazawa, Niigata-ken, JP;

Shigeto Yamada, Niigata-ken, JP;

Masaru Sakurai, Niigata-ken, JP;

Inventors:

Tsutomu Takeya, Niigata-ken, JP;

Kazuhiko Nakazawa, Niigata-ken, JP;

Shigeto Yamada, Niigata-ken, JP;

Masaru Sakurai, Niigata-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/335 (2006.01);
U.S. Cl.
CPC ...
Abstract

A thermal head includes a head substrate having a plurality of heating resistors which generate heat by electrical dissipation, a common electrode connected to one end of each heating resistor, and a plurality of individual electrodes connected to the other ends of the respective heating resistors. The head substrate is disposed on a heat-dissipation plate. A wide-gap stepped portion is disposed in correspondence with at least a location of the head substrate directly below the heating resistors, and increases an interval between an adhesion surface of the head substrate and an adhesion surface of the heat-dissipation plate. A resilient adhesive capable of absorbing thermal strain is interposed between the adhesion surface of the heat-dissipation plate and the adhesion surface of the head substrate in an adhesion plane where the wide-gap stepped portion is disposed.


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