The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2007
Filed:
Nov. 12, 2004
Applicants:
Mark Pavier, West Sussex, GB;
Ajit Dubhashi, Redondo Beach, CA (US);
Jorge Cerezo, Palos Verdes, CA (US);
Leigh Cormie, Mountain View, CA (US);
Vijay Bolloju, Cerritos, CA (US);
Inventors:
Mark Pavier, West Sussex, GB;
Ajit Dubhashi, Redondo Beach, CA (US);
Jorge Cerezo, Palos Verdes, CA (US);
Leigh Cormie, Mountain View, CA (US);
Vijay Bolloju, Cerritos, CA (US);
Assignee:
International Rectifier Corporation, El Segundo, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package that includes two semiconductor die each disposed on a respective die pad and a large tracking distance interposed between at least two leads of the package for better creepage characteristics.