The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2007
Filed:
May. 26, 2006
Kouichi Nagao, Kyoto, JP;
Yoshifumi Nakamura, Osaka, JP;
Hiroyuki Imamura, Osaka, JP;
Michinari Tetani, Osaka, JP;
Kouichi Nagao, Kyoto, JP;
Yoshifumi Nakamura, Osaka, JP;
Hiroyuki Imamura, Osaka, JP;
Michinari Tetani, Osaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A wiring board includes: a flexible insulating base; a plurality of conductive wiringsarranged on the flexible insulating base; protruding electrodesprovided respectively at an end portion of the same side of each of the conductive wirings; external terminalsformed respectively at the other end portions of each of the conductive wirings; metal plating layers applied on the conductive wirings, the protruding electrodes and the external terminals; and solder resist layersformed respectively by coating the conductive wirings in regions between the end portions at which the protruding electrodes are provided and the external terminals. In the regions where the solder resist layers are formed, no metal plating layers are formed on the conductive wirings, and the surfaces of the conductive wirings to be contacted with the flexible insulating base are rougher than the surfaces not to be contacted with the flexible insulating base. Even when a film base is thin, bending stress applied to the conductive wirings is relieved sufficiently, and thus breaks in the wirings are suppressed.