The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2007
Filed:
Jul. 12, 2004
Applicant:
Kae-hoon Lee, Seoul, KR;
Inventor:
Kae-Hoon Lee, Seoul, KR;
Assignee:
Dongbu Electronics Co., Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed is a method for forming a bonding pad of a semiconductor device. The present invention provides a method for forming a bonding pad of a semiconductor device comprising the steps of: (a) forming a top metal line having a predetermined width on a structure of a semiconductor substrate; (b) forming an insulating layer on the top metal line and the structure of the semiconductor substrate; (c) selectively etching the insulating layer to form a bonding pad which exposes portions of the top metal line; (d) performing a plasma treatment over the semiconductor substrate by using CF, Ar, and Ogas.