The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2007
Filed:
Apr. 24, 2003
Masahiko Mizutani, Ota, JP;
Sadamichi Takakusaki, Ota, JP;
Motoichi Nezu, Ora-gun, JP;
Kazutoshi Motegi, Ota, JP;
Mitsuru Noguchi, Nitta-gun, JP;
Masahiko Mizutani, Ota, JP;
Sadamichi Takakusaki, Ota, JP;
Motoichi Nezu, Ora-gun, JP;
Kazutoshi Motegi, Ota, JP;
Mitsuru Noguchi, Nitta-gun, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
In preferred embodiments, a method of manufacturing a hybrid integrated circuit device is provided, in which a plurality of circuit substratesare manufactured from a single metal substrateA' by dicing. In some embodiments, the method includes: preparing a metal substrateA′ having an insulating layerformed on the top surface thereof; forming a plurality of conductive patternson the top surface of insulating layer; forming groovesin lattice form on the rear surface of metal substrateB′; mounting hybrid integrated circuits onto conductive patterns; and separating individual circuit substrateswith, for example, a rotatable cutter.