The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2007
Filed:
May. 07, 2003
Jeffrey A. Thompson, Burbank, CA (US);
Adam L. Cohen, Los Angeles, CA (US);
Michael S. Lockard, Lake Elizabeth, CA (US);
Dennis R. Smalley, Newhall, CA (US);
Jeffrey A. Thompson, Burbank, CA (US);
Adam L. Cohen, Los Angeles, CA (US);
Michael S. Lockard, Lake Elizabeth, CA (US);
Dennis R. Smalley, Newhall, CA (US);
Microfabrica Inc., Van Nuys, CA (US);
Abstract
Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are form from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurs during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.