The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2007
Filed:
Mar. 01, 2004
Thomas Höfer, Lappersdorf, DE;
Herbert Brunner, Regensburg, DE;
Frank Möllmer, Matting b. Pentling, DE;
Günter Waitl, Regensburg, DE;
Rainer Sewald, Taufkirchen, DE;
Markus Zeiler, Nittendorf, DE;
Thomas Höfer, Lappersdorf, DE;
Herbert Brunner, Regensburg, DE;
Frank Möllmer, Matting b. Pentling, DE;
Günter Waitl, Regensburg, DE;
Rainer Sewald, Taufkirchen, DE;
Markus Zeiler, Nittendorf, DE;
Osram Opto Semiconductor GmbH, Regensburg, DE;
Abstract
An optoelectronic device, comprising a package body () and at least one semiconductor chip () arranged on the package body (). The surface of the package body () has a metallized subregion () and a non-metallized subregion (). The package body () includes at least two different plastics (), one of the plastics being non-metallizable () and this plastic determining the non-metallized subregion (). A method for producing such components and a method for the patterned metallization of a plastic-containing body are also provided.