The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2007
Filed:
Apr. 06, 2004
Applicants:
Keiji Yamane, Akou, JP;
Tetsuo Ueda, Wake-gun, JP;
Takashi Miyamoto, Akaiwa-gun, JP;
Isao Kidoguchi, Kawanishi, JP;
Inventors:
Keiji Yamane, Akou, JP;
Tetsuo Ueda, Wake-gun, JP;
Takashi Miyamoto, Akaiwa-gun, JP;
Isao Kidoguchi, Kawanishi, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for producing a semiconductor device of the present invention includes forming a surface electrode on a semiconductor element, forming a solder layer by plating on one principal surface of the surface electrode, mounting the semiconductor element on the sub-mount so that the solder layer contacts a principal surface of the sub-mount, and bonding the sub-mount and the semiconductor element to each other via the solder layer.