The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2007
Filed:
Mar. 22, 2002
Gi-young Yang, Yongin, KR;
Sang-hun Lee, Anyang, KR;
Gi-young Yang, Yongin, KR;
Sang-hun Lee, Anyang, KR;
Samsung Electronics Co., Ltd., Suwon, Kyungki-do, KR;
Abstract
An improved method for extrapolating worst-case Simulation Program with Integrated Circuit Emphasis (SPICE) model parameters for an integrated circuit including manufacturing semiconductor devices, measuring typical data and worst-case data with respect to various electrical characteristics of the manufactured devices, determining a set of typical SPICE model parameters using the typical data, and determining a set of worst-case SPICE model parameters using the typical data and the worst-case data. Determining the set of worst-case SPICE model parameters preferably includes extrapolating statistical model parameters using the typical data and the worst-case data and determining the set of worst-case SPICE model parameters using the statistical model parameters.