The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2007
Filed:
Jun. 19, 2001
Toshifumi Oida, Omihachiman, JP;
Takahiro Watanabe, Shiga-ken, JP;
Eigoro Ina, Shiga-ken, JP;
Norio Nakajima, Takatsuki, JP;
Toshifumi Oida, Omihachiman, JP;
Takahiro Watanabe, Shiga-ken, JP;
Eigoro Ina, Shiga-ken, JP;
Norio Nakajima, Takatsuki, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
An RF module includes a multi-layered substrate. A base-band IC, a memory IC, a quartz oscillator and surface-mount components are mounted on the upper surface of the multi-layered substrate. A metallic cap also is attached to the upper surface of the multi-layered substrate. A cavity is formed in the lower surface of the multi-layered substrate substantially at the center thereof. A first RF-IC and a second RF-IC are embedded in the cavity. Wiring patterns for providing connections between the base-band IC and the memory IC, through-holes, RF passive components, and the shield ground electrode pattern are disposed inside of the multi-layered substrate.