The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2007
Filed:
May. 19, 2004
Kenichi Kurita, Kitakatsuragi, JP;
Nobumasa Kaneko, Kitakatsuragi, JP;
Kenichi Kurita, Kitakatsuragi, JP;
Nobumasa Kaneko, Kitakatsuragi, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
A semiconductor light emitting apparatus includes a non-conductive sub mount; a metal layer provided on the sub mount; a solder material member provided on the metal layer; and a semiconductor light emitting device die-bonded to the metal layer by the solder material member. A surface of the metal layer includes a solder material attachment area having the solder material member attached thereto, and a metal layer exposed area where the surface of the metal layer is exposed. The solder material attachment area is electrically connected to the metal layer exposed area. The solder material attachment area is larger than a die-bond area of the semiconductor light emitting device. The metal layer exposed area has a metal layer removed area therein where the sub mount is exposed.