The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2007
Filed:
Jun. 30, 2004
Applicant:
Kyu-jin Lee, Cheonan-si, KR;
Inventor:
Kyu-Jin Lee, Cheonan-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A BGA package including a substrate, a plurality of solder balls on the semiconductor and an encapsulant, which leaves the solder balls partially exposed on the semiconductor chip, thereby reducing the size of the BGA package. In addition, an edge of the substrate may extend beyond an edge of the semiconductor chip. Stacked BGA packages and methods of manufacturing a BGA (or stacked BGA) package are also disclosed.
Lee, Kyu-Jin. (2007). Ball grid array package, stacked semiconductor package and method for manufacturing the same (U.S. Patent No. 7245008). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7245008
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile