The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2007
Filed:
Mar. 15, 2005
Tomoaki Utsumi, Chiyoda-ku, JP;
Kazuhiro Satou, Chiyoda-ku, JP;
Takashi Shirone, Chiyoda-ku, JP;
Kenji Tsuchiya, Chiyoda-ku, JP;
Masato Kobayashi, Chiyoda-ku, JP;
Tomoaki Utsumi, Chiyoda-ku, JP;
Kazuhiro Satou, Chiyoda-ku, JP;
Takashi Shirone, Chiyoda-ku, JP;
Kenji Tsuchiya, Chiyoda-ku, JP;
Masato Kobayashi, Chiyoda-ku, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A main circuit switching unit and an isolator are accommodated in a vacuum container. A first conductor and a main circuit conductor are arranged to extend in and out of the vacuum container. A movable electrode of the main circuit switching unit is connected to the first conductor through a first flexible conductor, and a movable electrode of the isolator is connected to the main circuit conductor through a second flexible conductor. A shield is arranged around the first conductor and the main circuit conductor. Another shield is arranged around a connecting portion between the first flexible conductor and the movable electrode of the main circuit switching unit. A still another shield is arranged around the isolator. A further another shield is arranged around the second flexible conductor. These shields are secured to the vacuum container through insulating spacers. This arrangement instantly eliminates a dielectric breakdown phenomenon that occurs at electric field concentrated regions by the shields to prevent a dielectric breakdown caused by particulate foreign matters and thereby improve an insulation reliability of the devices.