The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2007
Filed:
Oct. 27, 2004
David B. Blair, Blue Ridge, TX (US);
Leon Stiborek, Dallas, TX (US);
David B. Blair, Blue Ridge, TX (US);
Leon Stiborek, Dallas, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
The present invention provides, in one embodiment, a semiconductor wafer () dicing process. The dicing process comprises removing circuit features () from a street () located between dies () on a semiconductor substrate () using a first blade (), such that the semiconductor substrate is exposed, and cutting through the exposed semiconductor substrate using a second blade (). The first blade has a surface () coated with an abrasive material () comprising grit particles (), having a median diameter () of at least about 25 microns. The grit particles are adhered to the first blade with a bonding agent () having a hardness of about 80 or less (Rockwell B Hardness scale). The grit particles have a concentration in the bonding agent ranging from about 25 to about 50 vol %. Another embodiment of the invention is a method of manufacturing a semiconductor device ().