The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2007
Filed:
Oct. 19, 2005
Patricio V. Ancheta, Jr., Baguio, PH;
Ramil A. Viluan, Baguio, PH;
James R. M. Baello, Quezon, PH;
Elaine B. Reyes, Baguio, PH;
Patricio V. Ancheta, Jr., Baguio, PH;
Ramil A. Viluan, Baguio, PH;
James R. M. Baello, Quezon, PH;
Elaine B. Reyes, Baguio, PH;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A semiconductor device with a chip (), its position defining a plane, and an insulating substrate () with first and second surfaces; the substrate is substantially coplanar with the chip, without warpage. One of the chip sides is attached to the first substrate surface using adhesive material (), which has a thickness. The thickness of the adhesive material is distributed so that the thickness () under the central chip area is equal to or smaller than the material thickness () under the peripheral chip areas. Encapsulation compound () is embedding all remaining chip sides and the portions of the first substrate surface, which are not involved in the chip attachment. When reflow elements () are attached to the substrate contact pads, they are substantially coplanar with the chip.