The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2007
Filed:
Apr. 22, 2004
Applicants:
Shouhei Kozakai, Usui-gun, JP;
Akio Suzuki, Usui-gun, JP;
Nobuhiro Ichiroku, Usui-gun, JP;
Toshio Shiobara, Usui-gun, JP;
Inventors:
Shouhei Kozakai, Usui-gun, JP;
Akio Suzuki, Usui-gun, JP;
Nobuhiro Ichiroku, Usui-gun, JP;
Toshio Shiobara, Usui-gun, JP;
Assignee:
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/02 (2006.01); B32B 7/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
A dicing/die bonding adhesion tape includes a substrate, a silicone adhesive layer, and a bonding layer. A tack strength of 0.2–2.0 N/25 mm is developed between the silicone adhesive layer and the bonding layer. The bonding layer is formed of a bonding composition comprising (A) a polyimide resin, (B) an epoxy resin, and (C) an epoxy resin curing catalyst.