The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2007
Filed:
Dec. 22, 2004
Takashi Hakoda, Nagano-ken, JP;
Masahiko Miyajima, Nagano-ken, JP;
Takashi Hakoda, Nagano-ken, JP;
Masahiko Miyajima, Nagano-ken, JP;
Nissei Plastic Industrial Co., Ltd., Nagano-ken, JP;
Abstract
In a mold protection method for a mold clamping apparatus, a predetermined mold protection zone is set in a zone in which a mold is closed, and an anomaly such as presence of a foreign object is detected on the basis of a change in a physical quantity in the mold protection zone so as to protect the mold. The method includes the steps of previously setting, as a reference position, a closed position of a movable platen at which a target mold clamping force is obtained; setting an end position of the mold protection zone with respect to the reference position; obtaining, during a production operation, an actual closed position (detected position) of the movable platen; and correcting the end position of the mold protection zone on the basis of a deviation between the detected position and the reference position.