The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2007
Filed:
Apr. 01, 2002
Kouji Kamiya, Okazaki, JP;
Toshiaki Kondoh, Okazaki, JP;
Syuuichi Hazama, Okazaki, JP;
Takanori Tanaka, Toyota, JP;
Kosyun Fujiwara, Okazaki, JP;
Kouji Kamiya, Okazaki, JP;
Toshiaki Kondoh, Okazaki, JP;
Syuuichi Hazama, Okazaki, JP;
Takanori Tanaka, Toyota, JP;
Kosyun Fujiwara, Okazaki, JP;
Daiwa Kasei Industry Co., Ltd., Aichi, JP;
Toyota Jidosha Kabushiki Kaisha, Aichi, JP;
Abstract
An injection molding apparatus used comprises a molten resin injectorfor injecting a molten resin, and a dieconnected to the molten resin injector and communicating with the molten resin injector so that the molten resin is injected into the die. A cavity having a prescribed shape is formed within the die in order to mold the injected molten resin into the prescribed shape. An opening of the die for guiding the molten resin to the outside is blocked so as to confine a molding object as an object for molding the resin member. A plate memberas a molding object is compressed onto the dieand the molten resin is injected into the die while compressing the molding object. The molten resin is adhered on the molding object by being guided from the opening, and a solidified resin member comprising the solidified molten resin is bonded on the surface of the molding object. Consequently, the resin member having a prescribed shape is readily and promptly formed on the surface of the molding object.