The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2007

Filed:

Feb. 28, 2006
Applicants:

Kuang-yuan Chang, Shenzhen, CN;

Hong-liang Ding, Shenzhen, CN;

Hui Wang, Shenzhen, CN;

Wayne Shih, Shenzhen, CN;

Ta-yi Lin, Shenzhen, CN;

Li-xia Peng, Shenzhen, CN;

Hui-bing LI, Shenzhen, CN;

Inventors:

Kuang-Yuan Chang, Shenzhen, CN;

Hong-Liang Ding, Shenzhen, CN;

Hui Wang, Shenzhen, CN;

Wayne Shih, Shenzhen, CN;

Ta-Yi Lin, Shenzhen, CN;

Li-Xia Peng, Shenzhen, CN;

Hui-Bing Li, Shenzhen, CN;

Assignees:

Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Shenzhen, Guangdong Province, CN;

Hon Hai Precision Industry Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 11/30 (2006.01); G06F 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for monitoring surface mount technology (SMT) apparatuses includes the steps of: providing a data saving module for saving attribute data on the SMT apparatuses, the attribute data including maintenance parameters, repair parameters, and defect rate parameters; obtaining dynamic data on the SMT apparatuses in real time, the dynamic data including maintenance data, repair data, and defect rate data; and monitoring the SMT apparatuses by comparing the attribute data and the dynamic data on the SMT apparatuses.


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