The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2007
Filed:
Apr. 14, 2005
Applicants:
Tsuyoshi Kurauchi, Anjo, JP;
Tomoaki Nakano, Oobu, JP;
Hiroaki Arai, Kariya, JP;
Inventors:
Assignee:
Denso Corporation, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor module has metallic radiator plates provided at central regions of principal surfaces of a sealing resin so as to expose from these principal surfaces. The metallic radiator plates and the principal surfaces of the sealing resin are bonded via grease gaps to heat receiving members. The grease gaps are widened in outer regions far from the metallic radiator plates compared with inner regions adjacent to the metallic radiator plates, to prevent external air from entering into the grease gaps even when the semiconductor module causes repetitive thermal expansions and contractions.