The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2007
Filed:
Jan. 10, 2005
Hiroshi Oka, Kyoto, JP;
Hiroshi Oka, Kyoto, JP;
Rohm Co., Ltd., Kyoto, JP;
Abstract
A method for manufacturing a semiconductor device with plural semiconductor chips is provided. The method includes the step of attaching a second semiconductor chip to a first surface of a supporting member in a manner such that a third set of electrodes are wirelessly connected to the supporting member at positions outwardly from an opening of the supporting member. The method also includes the step of mounting a first semiconductor chip to the second semiconductor chip in a manner such that the main surfaces of the first and second semiconductor chips face each other while a first set of electrodes of the first semiconductor chip are wirelessly connected to a second set of electrodes in the opening of the supporting member.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile