The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2007
Filed:
Feb. 24, 2003
Shinji Isokawa, Kyoto, JP;
Tomoji Yamaguchi, Kyoto, JP;
Shinji Isokawa, Kyoto, JP;
Tomoji Yamaguchi, Kyoto, JP;
Rohm Co., Ltd., Kyoto, JP;
Abstract
A semiconductor device includes an insulating substratehaving an obverse surface formed with a die pad, a rectangular semiconductor chipsuch as an LED chip bonded to the die pad with a die bonding material, and a molded portionmade of a synthetic resin for packaging the semiconductor chip. The die padmay be rectangular with dimensions close to those of the semiconductor chip or circular with a diameter close to the diagonal dimension of the semiconductor chip, whereby the positioning and orienting of the semiconductor chip can be accurately performed in bonding the semiconductor chip.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile