The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2007

Filed:

Jan. 31, 2003
Applicants:

Dominik Eisert, Regensburg, DE;

Stephan Kaiser, Regensburg, DE;

Michael Fehrer, Bad Abbach, DE;

Berthold Hahn, Hemau, DE;

Volker Härle, Laaber, DE;

Inventors:

Dominik Eisert, Regensburg, DE;

Stephan Kaiser, Regensburg, DE;

Michael Fehrer, Bad Abbach, DE;

Berthold Hahn, Hemau, DE;

Volker Härle, Laaber, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 33/00 (2006.01); H01L 23/48 (2006.01); H01L 51/10 (2006.01); H01S 5/183 (2006.01);
U.S. Cl.
CPC ...
Abstract

A radiation-emitting semiconductor component has a semiconductor body containing a nitride compound semiconductor, and a contact metallization layer disposed on a surface of the semiconductor body. In this case, the contact metallization layer is covered with a radiation-transmissive, electrically conductive contact layer. The radiation generated is coupled out through the contact metallization layer or through openings in the contact metallization layer.


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