The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2007

Filed:

May. 27, 2005
Applicants:

Gregory J. Dunn, Arlington Heights, IL (US);

Remy J. Chelini, Crystal Lake, IL (US);

Timothy B. Dean, Elk Grove Village, IL (US);

Inventors:

Gregory J. Dunn, Arlington Heights, IL (US);

Remy J. Chelini, Crystal Lake, IL (US);

Timothy B. Dean, Elk Grove Village, IL (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In one embodiment, a peelable circuit board foil () has a metal support layer () and a conductive metal foil layer () bonded by an inorganic high temperature release structure () that comprises a co-deposited layer () and a metal oxide layer (). The co-deposited layer comprises an admixture of nickel and one or more of boron, phosphorus, and chromium. In a second embodiment, the peelable printed circuit foil () has a crystallized dielectric oxide layer () disposed on the metal foil layer and an electrode layer () disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil () that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.


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