The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2007

Filed:

Oct. 04, 2002
Applicants:

Peter Buss, Wood Forde, AU;

Michael Reginald Dalton, Ingle Farm, AU;

Riccardo Angelo Leo Gatto, Gardeni, AU;

James Dominic Buob, Mitcham, AU;

Inventors:

Peter Buss, Wood Forde, AU;

Michael Reginald Dalton, Ingle Farm, AU;

Riccardo Angelo Leo Gatto, Gardeni, AU;

James Dominic Buob, Mitcham, AU;

Assignee:

Sentek Pty Ltd, Stepney, South Australia, AU;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
E21B 49/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

This invention relates to probes used in the ground for the collection of data relating to soil conditions and in particular to a construction and method of insertion of probe bodies that will house such probes. A probe body insertion apparatus comprises a tool for forming an opening in the soil using a stabilization device that encourages the excavation of an opening that is orthogonal to the surrounding ground level and which is smaller in diameter than the soil probe body to be inserted. The inserted end of the probe body is formed with a hollow portion having an opening that is downwardly facing and adapted to slice away a portion of the prepared opening. The soil sliced away falls to the base of the prepared opening. The hollow portion of the inserted end of the probe body envelopes the loose soil but allows the probe body to be inserted to the desired depth. The slicing action provides a smooth interface between the soil and the outer surface of the probe body, which is preferable for proper working of sensors used inside the probe body to measure soil parameters.


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