The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2007

Filed:

Mar. 09, 2004
Applicants:

Li-yan Zhu, San Jose, CA (US);

Kazumasa Yasuda, Sunnyvale, CA (US);

Cheng Yih Liu, San Jose, CA (US);

Winston Jose, San Jose, CA (US);

Inventors:

Li-Yan Zhu, San Jose, CA (US);

Kazumasa Yasuda, Sunnyvale, CA (US);

Cheng Yih Liu, San Jose, CA (US);

Winston Jose, San Jose, CA (US);

Assignee:

SAE Magnetics (H.K.), Ltd., Shatin, N.T., HK;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/127 (2006.01); G11B 21/21 (2006.01); G11B 5/39 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to an embodiment of the present invention, a slider design is presented that provides improved protection for the head/sensor of the slider. In one embodiment, the design of the slider is such that ESD protection is provided during the slider wafer process, the 'back-end' processes (e.g., when the completed slider/head is incorporated into an HGA), and during operation in a disk drive or the like. In this embodiment, a conductive film is provided that surrounds the insulating-material slider substrate. The conductive film provides a grounding path during the wafer fabrication processes. This conductive layer may be further patterned during head fabrication to provide a ground path for back-end fabrication processes. A conductive stripe may be added for discharging debris in the slider-to-disk interface.


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