The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2007
Filed:
Nov. 08, 2002
David W. Duquette, Minneapolis, MN (US);
Paul R. Haugen, Bloomington, MN (US);
David Fishbaine, Minnetonka, MN (US);
John D. Gaida, Victoria, MN (US);
David D. Madsen, Lakeland, MN (US);
Theodore Paul Dale, Minneapolis, MN (US);
Todd D. Liberty, Apple Valley, MN (US);
Brant O. Buchika, Minnetonka, MN (US);
Scott D. Roth, Newburyport, MA (US);
Thomas W. Bushman, Marblehead, MA (US);
David W. Duquette, Minneapolis, MN (US);
Paul R. Haugen, Bloomington, MN (US);
David Fishbaine, Minnetonka, MN (US);
John D. Gaida, Victoria, MN (US);
David D. Madsen, Lakeland, MN (US);
Theodore Paul Dale, Minneapolis, MN (US);
Todd D. Liberty, Apple Valley, MN (US);
Brant O. Buchika, Minnetonka, MN (US);
Scott D. Roth, Newburyport, MA (US);
Thomas W. Bushman, Marblehead, MA (US);
CyberOptics Corporation, Golden Valley, MN (US);
Abstract
Improved component placement inspection and verification is performed by a pick and place machine. Improvements include stereovision imaging of the intended placement location; enhanced illumination to facilitate the provision of relatively high-power illumination in the restricted space near the placement nozzle(s); optics to allow image acquisition device to view the placement location from an angle relative to a plane of the placement location, thereby reducing the possibility of such images being obstructed by the component; techniques for rapidly acquiring images with commercially available CCD arrays such that acquisition of before and after images does not substantially impact system throughput; and image processing techniques to provide component inspection and verification information.