The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2007

Filed:

Jun. 27, 2003
Applicants:

Elliott R. Brown, Glendale, CA (US);

John D. Evans, Arlington, VA (US);

Christopher A. Bang, San Diego, CA (US);

Adam L. Cohen, Los Angeles, CA (US);

Michael S. Lockard, Lake Elizabeth, CA (US);

Dennis R. Smalley, Newhall, CA (US);

Morton Grosser, Menlo Park, CA (US);

Inventors:

Elliott R. Brown, Glendale, CA (US);

John D. Evans, Arlington, VA (US);

Christopher A. Bang, San Diego, CA (US);

Adam L. Cohen, Los Angeles, CA (US);

Michael S. Lockard, Lake Elizabeth, CA (US);

Dennis R. Smalley, Newhall, CA (US);

Morton Grosser, Menlo Park, CA (US);

Assignee:

Microfabrica Inc., Van Nuys, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 9/00 (2006.01); H01P 3/00 (2006.01); H01P 3/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).


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