The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2007

Filed:

Jul. 18, 2005
Applicants:

Dale F. Berndt, Plymouth, MN (US);

Andrzej Peczalski, Eden Prairie, MN (US);

Eric E. Vogt, Minneapolis, MN (US);

William F. Witcraft, Minneapolis, MN (US);

Inventors:

Dale F. Berndt, Plymouth, MN (US);

Andrzej Peczalski, Eden Prairie, MN (US);

Eric E. Vogt, Minneapolis, MN (US);

William F. Witcraft, Minneapolis, MN (US);

Assignee:

Honeywell International Inc., Morristown, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for incorporating magnetic materials in a semiconductor manufacturing process includes manufacturing a semiconductor device including interlayers and dielectric layers, depositing a magnetic layer above a semiconductor device and forming metallized contacts for connecting interlayers of the semiconductor device. With the method of the present invention, the deposition of the magnetic material is integrated with the semiconductor manufacturing process.


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