The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2007

Filed:

Jan. 05, 2005
Applicants:

Kuo-len Lin, Wugu Township, Taipei County, TW;

Hui-min Tsui, Wugu Township, Taipei County, TW;

Ken Hsu, Wugu Township, Taipei County, TW;

Inventors:

Kuo-Len Lin, Wugu Township, Taipei County, TW;

Hui-Min Tsui, Wugu Township, Taipei County, TW;

Ken Hsu, Wugu Township, Taipei County, TW;

Assignee:

Cpumate Inc., Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 6/00 (2006.01); F28F 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat-dissipating device with an isothermal plate assembly of predetermined shape and method for manufacturing the same are proposed. An upper plate and a lower plate with predetermined shape are provided and an accommodation groove is defined therein. A flattened heat pipe is bent into the predetermined shape and placed into the accommodation space. A binding agent is applied on the face between the heat pipe, the upper plate and the lower plate. A heat-dissipating unit composed of a plurality of heat-dissipating fins is assembled to a concave portion of the isothermal plate assembly of the predetermined shape. The upper plate and the lower plate are assembled with outer coupling unit and then a hot melting process is executed. The resultant product is then cooled to form a finished heat-dissipating device with an isothermal plate assembly of predetermined shape.


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