The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2007
Filed:
Dec. 17, 2003
Masashi Gotoh, Tokyo, JP;
Kaoru Kawasaki, Tokyo, JP;
Mutsuko Nakano, Tokyo, JP;
Hiroshi Yamamoto, Tokyo, JP;
Masashi Gotoh, Tokyo, JP;
Kaoru Kawasaki, Tokyo, JP;
Mutsuko Nakano, Tokyo, JP;
Hiroshi Yamamoto, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
Provided is a method of manufacturing an electronic part having a plurality of wiring patterns and an insulating layer interposed between the wiring patterns and serving to establish electrical connection between the wiring patterns through an interlayer connecting portion penetrating the insulating layer. In the method, a first step of forming a wiring pattern and a columnar conductor and a second step of forming a layer having a uniform thickness by bonding an insulating sheet from above and pressing the insulating sheet to the height of the columnar conductor with the columnar conductor as a stopper so as to conform the thickness of the insulating sheet to the height of the columnar conductor are repeated.