The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2007

Filed:

Feb. 05, 2003
Applicants:

Hideaki Takahashi, Higashine, JP;

Tetsuo Hosokawa, Higashine, JP;

Inventors:

Hideaki Takahashi, Higashine, JP;

Tetsuo Hosokawa, Higashine, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11B 7/24 (2006.01);
U.S. Cl.
CPC ...
Abstract

A recording medium including a resin substrate having a first thermal expansion coefficient, a center hole, a first surface, and a second surface opposite to the first surface, a recording layer formed on the first surface of the resin substrate and having a recording region, an inner nonrecording region formed inside the inner periphery of the recording region, and an outer nonrecording region formed outside the outer periphery of the recording region, and a protective layer formed on the second surface of the resin substrate except an inner peripheral region having a predetermined range from the center hole, the recording region, and the outer nonrecording region. The thermal deformation suppressing layer has a second thermal expansion coefficient smaller than the first thermal expansion coefficient.


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