The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2007
Filed:
Jul. 19, 2002
Kenichi Nagayama, Tsurugashima, JP;
Akira Sugimoto, Tsurugashima, JP;
Satoshi Miyaguchi, Tsurugashima, JP;
Kenichi Nagayama, Tsurugashima, JP;
Akira Sugimoto, Tsurugashima, JP;
Satoshi Miyaguchi, Tsurugashima, JP;
Pioneer Corporation, Tokyo, JP;
Abstract
A layered wiring line of silver or silver alloy includes a silver or silver alloy conductor layer including silver or silver alloy; and a protective conductor layer layered on and covering the silver or silver alloy conductor layer. A method for forming the layered wiring line includes steps of: layering the silver or silver alloy conductor layer and the protective conductor layer on a substrate in turn; making the protective conductor layer in contact with a liquid etchant common to the silver or silver alloy conductor layer and the protective conductor layer by a predetermined pattern. The protective conductor layer has a thickness satisfying a relationship in that a ratio of (the protective conductor layer's thickness)/(the silver or silver alloy conductor layer's thickness) is less than that of (a solution velocity of the protective conductor layer in the liquid etchant)/(a solution velocity of the silver or silver alloy conductor layer in the liquid etchant).