The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7235874 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 26, 2007

Filed:

Oct. 25, 2004
Applicant:

Hideo Miyasaka, Sakata, JP;

Inventor:

Hideo Miyasaka, Sakata, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/34 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes an interposer having first and second faces pointing in opposite directions to each other and a metallization pattern formed on the first face, and a semiconductor chip mounted on the first face of the interposer and having an electrode electrically connected with the metallization pattern. The interposer has a spacer formed within an overlapping region of the second face which the semiconductor chip overlaps and a land formed out of the overlapping region of the second face which the semiconductor chip overlaps. The spacer is formed so as not to be electrically connected with the metallization pattern, and the land is electrically connected with the metallization pattern.


Find Patent Forward Citations

Miyasaka, Hideo. (2007). Semiconductor device, its manufacturing method, circuit board, and electronic unit (U.S. Patent No. 7235874). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7235874

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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