The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2007
Filed:
Feb. 24, 2005
Masahiro Aoyagi, Hitachinaka, JP;
Aki Nakajo, Yokohama, JP;
Hirofumi Tsuchiyama, Hitachinaka, JP;
Shinobu Nakamura, Abiko, JP;
Masahiro Aoyagi, Hitachinaka, JP;
Aki Nakajo, Yokohama, JP;
Hirofumi Tsuchiyama, Hitachinaka, JP;
Shinobu Nakamura, Abiko, JP;
Trecenti Technologies, Inc., Ibaraki, JP;
Abstract
Setting a polishing rate and a polishing time in chemical mechanical polishing can be performed with high accuracy by considering a product wafer of an object to be polished, and an instrumental error between apparatuses to be used, etc. By using, as a calculating formula, a formula well approximating a portion of a curve representing a state of chemical mechanical polishing on a side showing a target polishing amount, the polishing rate and the polishing time can be set with high accuracy according to a state of chemical mechanical polishing for actually polishing a product wafer. In the calculating formula, a parameter 'A' relating to a film property of a film of an object to be polished, a parameter 'B' relating to a roughness state of a film surface, and a parameter “C” relating to an instrumental error differential between apparatuses of a chemical mechanical polishing apparatus are joined by operators.