The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2007
Filed:
Mar. 18, 2005
Baomin Xu, Cupertino, CA (US);
Steven A. Buhler, Sunnyvale, CA (US);
Michael C. Weisberg, Woodside, CA (US);
William S. Wong, San Carlos, CA (US);
Scott E. Solberg, Mountain View, CA (US);
Karl A. Littau, Palo Alto, CA (US);
John S. Fitch, Los Altos, CA (US);
Scott A. Elrod, La Honda, CA (US);
Baomin Xu, Cupertino, CA (US);
Steven A. Buhler, Sunnyvale, CA (US);
Michael C. Weisberg, Woodside, CA (US);
William S. Wong, San Carlos, CA (US);
Scott E. Solberg, Mountain View, CA (US);
Karl A. Littau, Palo Alto, CA (US);
John S. Fitch, Los Altos, CA (US);
Scott A. Elrod, La Honda, CA (US);
Palo Alto Research Center Incorporated, Palo Alto, CA (US);
Abstract
A method of producing at least one thick film element, including depositing a material on a surface of at least one first substrate to form at least one thick film element structure having a thickness of approximately greater than 10 μm to 100 μm. Then, then the at least one thick film element structure is bonded to a second substrate, and the at least one first substrate is removed from the at least one thick film element structure using a lift-off process employing radiation energy. The lift-off process including emitting, from a radiation source, a radiation beam through the first substrate to an attachment interface formed between the first substrate and the at least one thick film element structure at the first surface of the first substrate. The first substrate being substantially transparent at the wavelength of the radiation beam, permitting the radiation beam to generate sufficient energy at the interface to break the attachment.