The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2007
Filed:
Dec. 28, 2004
Jung-kuk Lee, Yongin-si, KR;
Young-man Ahn, Yongin-si, KR;
Seung-man Shin, Suwon-si, KR;
Jong-cheol Seo, Gyeonggi-do, KR;
Jung-Kuk Lee, Yongin-si, KR;
Young-Man Ahn, Yongin-si, KR;
Seung-Man Shin, Suwon-si, KR;
Jong-Cheol Seo, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A test board for a high-frequency system level test: The test board includes a main board having through holes filled with a conductive material. These holes may be located at a portion of the main board from which an existing module socket has been removed. An interface board has surface mounted device (SMD) pads on front and rear surfaces. The SMD pads on the front surface of the interface board are connected with the SMD pads on the rear surface thereof through cross connection wiring within the interface board for a pin swap. The through holes of the main board are connected with the SMD pads on the rear surface of the interface board via iron cores fixed at a guide. A test module socket is mounted on surfaces of the SMD pads on the front surface of the interface board.