The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2007
Filed:
Aug. 11, 2005
Kazuaki Ano, Hiji-machi, JP;
Kazuaki Ano, Hiji-machi, JP;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A device with a solder joint made of a copper contact pad () of certain area () and an alloy layer () metallurgically attached to the copper pad across the pad area. The alloy layer contains copper/tin alloys, which include CuSnintermetallic compound, and nickel/copper/tin alloys, which include (Ni,Cu)Snintermetallic compound. A solder element () including tin is metallurgically attached to the alloy layer across the pad area. No fraction of the original thin nickel layer is left after the reflow process. Copper/tin alloys help to improve the drop test performance, nickel/copper/tin alloys help to improve the life test performance.