The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2007

Filed:

Jul. 18, 2003
Applicants:

Haruki Sentani, Hiroshima, JP;

Koji Tanaka, Hiroshima, JP;

Inventors:

Haruki Sentani, Hiroshima, JP;

Koji Tanaka, Hiroshima, JP;

Assignee:

Nishikawa Rubber Co., Ltd., Hiroshima-Ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided a molded productwhich is formed by placing an insertin a molding spaceformed by an upper dieand a lower die, followed by an injection process of molding material to form a molded body. The insertis comprised of an insert bodywhich is embedded in the molded bodyand a removing partwhich is integrally formed with the insert bodyvia a thin partat one end while the other end is projected to expose at a non-front surfaceside. The removing partfunctions to prevent the insert bodyfrom moving from its proper position as the other end is firmly held between the upper dieand the lower dieduring a molding operation. The removing partis removed from the insert bodyby cutting the thin partafter released from the die mold.


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