The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2007
Filed:
Apr. 23, 2004
Shinji Uchida, Kanagawa, JP;
Junya Kajimoto, Kanagawa, JP;
Akihito Funakoshi, Kanagawa, JP;
J.S.T. Mfg. Co., Ltd., Osaka, JP;
Abstract
A connection structure for a printed wiring board which enables high density integration is provided. A FCPincludes an exposed conductor partA including an insulating substrateand a reinforcing platestacked with this substratevia an elastic member. In the exposed conductor partA, conductorseach having a protrusionformed on a surface is placed on the insulating substrate. The exposed conductor partA can be elastically deformed in the thickness direction in which the substrate, the reinforcing plateand the like are stacked. A printed wiring boardis constructed by stacking an inner layer boardand a first outer layer boardand a second outer layer boardwhich sandwich this inner layer board. A notched grooveA is formed on the inner layer board, and an insertion openingB is formed. Through-hole portswhich appear on the notched grooveA side is placed on the first outer layer board. When the FPCis inserted into the insertion openingB, the protrusionof the FPCfits with the through-hole portA from within insertion openingB and presses thereto.