The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2007
Filed:
Dec. 22, 2003
Liangfeng Xu, Coppell, TX (US);
Tommi Reinikainen, Tuusula, FI;
Arni Kujala, Espoo, FI;
Wei Ren, Frisco, TX (US);
Ian Niemi, Inkere, FI;
Ilkka Kartio, Tokyo, JP;
Liangfeng Xu, Coppell, TX (US);
Tommi Reinikainen, Tuusula, FI;
Arni Kujala, Espoo, FI;
Wei Ren, Frisco, TX (US);
Ian Niemi, Inkere, FI;
Ilkka Kartio, Tokyo, JP;
Nokia Corporation, Espoo, FI;
Abstract
A multi-layer printed wire board (PWB) structure optimized for improved drop reliability, reliable electrical connections under thermal load, and minimal thickness is provided, along with a mobile terminal, including the PWB. The PWB includes alternating conductive layers and insulative layers. The outermost three layers form an interconnect structure constructed of two conductive layers surrounding an insulative-coated conductive layer. The thicknesses of the various layers are optimized to have an increased resistance to mechanical shock resulting from, for instance, a drop onto a hard surface. In addition, the optimized PWB structure has a minimized thickness and an improved resistance to connection failures resulting from cyclical thermal loads.