The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2007
Filed:
Nov. 22, 2000
Charles M. Darcangelo, Corning, NY (US);
Robert Sabia, Corning, NY (US);
Robert D. Sell, Horseheads, NY (US);
Harrie J. Stevens, Corning, NY (US);
Ljerka Ukrainczyk, Painted Post, NY (US);
Charles M. Darcangelo, Corning, NY (US);
Robert Sabia, Corning, NY (US);
Robert D. Sell, Horseheads, NY (US);
Harrie J. Stevens, Corning, NY (US);
Ljerka Ukrainczyk, Painted Post, NY (US);
Corning Incorporated, Corning, NY (US);
Abstract
The invention utilizes colloidal silica soot () in a semiconductor process for chemical-mechanical planarizing a semiconductor integrated circuit workpiece () with a slurry (). The particulate abrasive agent colloidal solid sphere fused silica soot () provides a beneficial CMP slurry/process for semiconductor device manufacturing compared to standard semiconductor CMP slurries with conventional colloidal sol-gel or fumed silica.