The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2007
Filed:
Oct. 06, 2005
Yeong Gyu Lee, Gyeonggi-do, KR;
Jong Hyeong Song, Gyeonggi-do, KR;
Sang Kyeong Yun, Gyeonggi-do, KR;
Heung Woo Park, Seoul, KR;
Chang Su Park, Gyeonggi-do, KR;
Yeong Gyu Lee, Gyeonggi-do, KR;
Jong Hyeong Song, Gyeonggi-do, KR;
Sang Kyeong Yun, Gyeonggi-do, KR;
Heung Woo Park, Seoul, KR;
Chang Su Park, Gyeonggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package using flip-chip mounting technique is disclosed. The semiconductor package includes: a semiconductor device provided with a plurality of first pads extending from the semiconductor device; a substrate provided with a plurality of second pads extending from the substrate at positions in registry with the location of the first pads of the semiconductor device; and an anisotropic conductive material interposed between the plurality of first pads and the plurality of second pads to electrically connect the first pads to associated second pads, the anisotropic conductive material positioned at discrete locations around the semiconductor device, thereby providing unobstructed clearance at desired locations between the semiconductor device and the substrate.